Antonio Carlos Valente, Martin Luest, and Jose Pallete headline the IEC's first Latin American conference and exhibition this 3-6 December; more than 160 industry experts from around the globe will gather to speak at the World Forum
Chicago - 29 October 2007 - The International Engineering Consortium presents the Broadband World Forum Americas, which will host more than 160 key players to speak at its conference, complemented by a cutting -edge exhibition at the ITM Expo in São Paulo, Brazil with Official Host Sponsor Telefónica.
"The IEC takes pride in its mission, part of which is to help drive the industry forward and catalyze progress in emerging markets around the world by improving communications and information exchange," commented IEC President John Janowiak. "The Broadband World Forums in Europe and Asia have been known to supply their respective markets with invaluable education, numerous networking opportunities and profitable business development…we're thrilled to provide the same world -class education and business development opportunities to the Latin American region."
World Forum Chair and Keynoter Antonio Carlos Valente further added, "Due to the high level of corporations, institutions, and professionals that will participate, the Broadband World Forum Americas offers a rare opportunity to discuss the current situation and find ways to turn industry challenges into new business opportunities and to disseminate broadband solutions worldwide." He continued, "…Telefónica is proud to sponsor an event of such magnitude, in which the exchange of ideas and experiences will certainly open new horizons for such a dynamic and competitive segment…"
Keynoter Martin Luest, head of the broadband access business unit of Nokia Siemens Networks, will also take the stage at the Broadband world Forum Americas 2007 and present the industry with an address entitled "Capturing the Broadband Opportunity."
"Nokia Siemens Networks is excited about the opportunity to actively sponsor and contribute to the BBWF in São Paulo and considers the BBWF for Asia -Pacific, Europe, and Americas as key events in our broadband industry to present our latest visions and to learn from industry leading experts and executives about the latest trends in the broadband industry," concluded Mr. Luest.
Mr. José Pallete, president of Telefónica Internacional, will also contribute his executive perspective with a keynote address at the Broadband World Forum Americas 2007.
Key industry players who will showcase their latest advancements on the exhibition floor of the Broadband World Forum Americas include Official Host Sponsor Telefónica; Nokia Siemens Networks; Alcatel -Lucent; NEC; Juniper Networks; ADVA Optical Networking; Aricent; ARRIS; Comtrend; Ecocarrier; KEYMILE; Optelian; Redline Communications; Sandvine; ThinkFree; Thomson; Vecima Networks and more.
To sponsor or exhibit at the event, contact Cliff Ruffin at +1 -312 -559 -3301 or Christine Paplaczyk at +1 -312 -559 -4616.
Speaking opportunities are also still available for a limited time at: www.iec.org/events/2007/bbwf_americas/conference/speaker.html .
For full information, visit www.iec.org/events/2007/bbwf_americas/ or contact Lisa Reyes at +1 -312 -559 -3325 or email@example.com.