CEDIA 2014 - Summit Semiconductor Announces Availability of Extended Distance Modules In Support of the Wireless Speaker and Audio Association's Whole House Audio Specification
Product Demonstrations at CEDIA Expo 2014
Denver, CO, September 9, 2014, Summit Semiconductor, a leader in advanced wireless audio technologies today announced the availability of new extended distance transmit and receive modules for multi-zone home theater and whole home audio applications that support the Wireless Speaker and Audio (WiSA®) Association's updated compliance and interoperability test specification. The new modules can transmit high quality, uncompressed audio up to 100 meters line of site. Product demonstrations will take place during CEDIA Expo 2014, Denver Convention Center, in the WiSA Association's sound room 13, September 11-13, 2014.
"These new transmit modules enable a single WiSA compliant audio system to support both multi-channel wireless home theater as well as multi-zone, whole house audio streaming," said Tom Lee, president of the WiSA Association. "Consumers will no longer have to purchase two separate audio systems, one for home theater and a different system for streaming audio content around the house. Both popular capabilities can be addressed by a single WiSA certified audio system at significant cost savings to the consumer."
When integrated in an AVR, audio hub, HDTV, Blu-ray player or gaming console, a single transmit module can manage up 32 speakers, and 8 different zones with separate volume control while simultaneously supporting both home theater and multi-zone audio transport. For example, during CEDIA Expo the WiSA Association will be demonstrating a wireless 5.1 home theater system with Summit's extended distance modules that will also simultaneously transmit a separate stereo pair with different content to a separate location. The new extended distance modules come pre-certified by country and are backward compatible to the prior generation of Summit's home theater wireless modules. Engineering samples for the new extended distance modules are available from Summit Semiconductor.
"We're excited to offer the new extended distance modules in support of the WiSA Association's multi-zone and whole house initiative," said Tony Parker, vice president of marketing, Summit Semiconductor. "This is a perfect tool for audio products that need high resolution multi-channel audio, but want to appeal to a broader base as a multi-media whole house platform. Products such as a HDTV, AVR/Pre-amp, game console, soundbar and HTiB can benefit significantly from adding these modules to their designs."
If you are interested in receiving a product demonstration at CEDIA Expo, Denver Convention Center, September 11-13, 2014, please visit sound room 13 at the WiSA Association.
About Summit Semiconductor, LLC:
Summit Semiconductor, LLC, has over a decade of fabless semiconductor chip design and wireless system integration experience targeting the wireless audio markets. Its award-winning Summit Wireless™ technology is the leading integrated circuit solution enabling home and Pro-Audio systems to distribute high-definition, distortion-free audio with ease. Summit Semiconductor is headquartered in Hillsboro, OR, USA, with offices in San Jose, CA, Taiwan, China and Japan. For more information on Summit Semiconductor, please visit www.summitsemi.com