Foveon and Dongbu Electronics team up to deliver world's most advanced CMOS image sensors

Foveon 14.1 MP X3 Direct Image Sensor at: http://www.thomas
Foveon 14.1 MP X3 Direct Image Sensor - photo 2 at: http://www.thomas

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Foveon and Dongbu Electronics team up to deliver world's most advanced CMOS image sensors

Santa Clara, CA, October 23, 2006 - Foveon, a leading U.S. fabless image sensor company, announced today that it has released the first product manufactured by its new strategic manufacturing partner, Dongbu Electronics of Seoul, South Korea. The new 14.1 megapixel X3 DSLR image sensor is the highest resolution X3 sensor available. This latest X3 sensor incorporates design and process enhancements which deliver best -in -class performance and market -leading resolution for the consumer DSLR camera market. Foveon and Dongbu have worked for more than a year to enhance X3 Technology and develop high quality and cost -effective X3 image sensor manufacturing capability.

Foveon's proprietary X3 technology is the only image sensor technology that stacks red, green and blue pixels vertically, increasing the information density of the recorded image while simultaneously eliminating the color sampling artifacts found with other image sensors. The new X3 sensor packs 14.1 million pixels, each 7.8µm in size, into a 3 -dimensional array of 2652 x 1768 x 3 pixels with an active image area measuring 20.69 x 13.79 mm.

Foveon and Dongbu have worked closely to bring X3 Technology to its highest level of performance to date. "We are tremendously excited about our partnership with Dongbu and the production of our first sensors in their world -class CIS manufacturing facilities in Korea," said David Matteucci, VP of Operations at Foveon. "Foveon chose Dongbu Electronics as our foundry partner because they are a leading image sensor foundry with cost -effective high -quality image sensor manufacturing capabilities as well as an industry -wide reputation for technology leadership," he added. Dongbu Electronics' Executive Vice President Dr. Jae Song said "We are proud of our achievement in bringing Foveon's unique stacked pixel technology to market - this is exactly the kind of advanced technology capability that demonstrates why Dongbu Electronics is a leader in the image sensor foundry business."

The new Foveon sensor is in production now, and will soon be available in new cameras manufactured by Sigma Corporation of Tokyo, Japan. Foveon and Dongbu Electronics will continue to collaborate on Foveon X3 image sensor products for a wide range of consumer and other applications.

About Foveon
Foveon Inc. was founded in 1997 by Dr. Carver Mead, a pioneer in solid -state electronics and VLSI design, and professor emeritus at the California Institute of Technology. The company's mission is to become a leading supplier of image capture solutions through the development of innovative technology and products. Foveon, located in Santa Clara, CA, is led by CEO and veteran Silicon Valley inventor and entrepreneur Federico Faggin, and is privately held.

About Foveon X3 Technology
Foveon pioneered the direct image sensor product category with its X3 sensor technology in 2001. Foveon X3 sensors are built using a pixel layering concept in which red, green, and blue pixels are stacked on top of each other. All competing color image sensor technologies rely on a pattern of red, green, and blue pixels that arranged next to each other. By stacking pixels, Foveon achieves a higher pixel density, increasing the image quality obtainable per unit area of silicon. The stacked pixel array has the added benefit of eliminating color sampling artifacts, without requiring the use of an optical blur filter.

About Dongbu Electronics
Dongbu Electronics provides world -class CMOS processing for system -on -chip solutions that integrate advanced logic, analog, and mixed -signal technologies. As a "Specialty Solution Partner" in high -growth markets, such as those represented by mobile handsets and flat -panel displays, Dongbu adds high value with specialized processing for CMOS Image Sensor (CIS), High Voltage, Embedded Flash, and LCD Driver IC (LDI) functions. Dongbu's collaborate -and -thrive approach is evident across the entire manufacturing spectrum including prototype development/verification, packaging/module development, complete turnkey solutions, and accelerating time to volume production. The company's stock is publicly traded under 001830 on the Korea Stock Exchange.

For more information on Dongbu Electronics of South Korea, please visit:

For more information on Sigma Corp. of Japan and the new Foveon -powered cameras, please visit: and http://www.sigma

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