Japanese module manufacturer will produce ZigBee modules based on Chipcon and Freescale IEEE 802.15.4 compliant RF platforms.
San Diego, California (July 11, 2005) - Figure 8 Wireless, the leading provider of ZigBee -ready software and firmware and a subsidiary of the Chipcon Group, and Shinko Electric Industries Co., LTD., a leading company in the world of semiconductor packaging by producing Plastic Laminated Packages (PLP), Lead Frames, and Glass -to -Metal Seals, announced a licensing agreement between the companies for Figure 8 Wireless' Z -Stack embedded ZigBee -compliant networking software for the Chipcon CC2420, the soon to be released CC2430 and the Freescale MC13192 IEEE 802.15.4 RF platforms.
Shinko has licensed the Figure 8 Wireless ZigBee software tools and network stack to produce its ZigBee OEM modules based on the Chipcon and Freescale RF chipsets. Upon compliance testing of the CC2430 module, OEMs will have three microcontroller choices from Shinko including the Atmel, AVR AtmegaL128, the Freescale HC(s)08 and the 8051 core, in the single chip CC2430 solution.
"We are pleased to welcome Shinko to the rapidly growing family of customers relying on Figure 8 Wireless for their ZigBee -compliant software solutions," commented Graham Martin, President of Figure 8 Wireless. "Shinko is a very well respected OEM module supplier to the Japanese market and beyond. We look forward to supporting their efforts in serving the entire ZigBee ecosystem."
Shinko's initial offering will include the Chipcon CC2420 and Freescale MC13192 modules, followed by the CC2430, after the latter is released later this year and is certified by the ZigBee Alliance. The modules will be available Q4 of 2005 and will target building, home and industrial control, and telemetry markets.
Kuniyuki Tanaka, Deputy General Manager, R&D Div. of Shinko added, "The ZigBee market is achieving rapid momentum. By licensing the Figure 8 ZigBee solution, we are able to bring to our customers the gold standard ZigBee software solution. Our innovative packaging technology, combined with this ZigBee solution, will enable us to become a market leader in OEM module solutions for OEMs worldwide."
About Figure 8 Wireless, Inc.
Figure 8 Wireless is leading the way in wireless device connectivity and networking based on the Zigbee/802.15.4 standards. Figure 8's Z -Stack and Z -Tools embedded software and development tools are in the hands of OEM device manufacturers on four continents. Figure 8 Wireless is sister company to Chipcon AS, a member of the Chipcon Group of Oslo, Norway. For more information, visit Figure 8's Web site at http://www.f8w.com, e -mail at firstname.lastname@example.org or call the company directly at (858) 552 -8500 x9.
About Shinko Electric Industries Co., LTD.
Shinko Electric Industries Co., LTD. was founded in Nagano, Japan in 1946. Shinko is an all round manufacturer of semiconductor packages, notably leadframe and PLP(Plastic Laminated Package), and recognized as a leader in the industry. More information on Shinko is available on Shinko's web site: http://www.shinko.co.jp